发明名称 |
SUBSTRATE CONVEYING MECHANISM AND SUBSTRATE CONVEYING METHOD |
摘要 |
A substrate conveying mechanism capable of reducing a contact area between holding members and a substrate and accurately delivering the substrate through a placing plate on the placing plate for conveying the substrate, comprising the first holding member moved on the placing plate in a specified direction and capable of pushing the substrate on the placing plate from one side face thereof and the plurality of second holding members capable of pushing the substrate from the reverse side of the one side face interlockingly with the movement of the first holding member, whereby since the first holding member and the second holding members push the side faces of the substrate, the substrate on the placing plate can be held at a placing position.
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申请公布号 |
WO03092068(A1) |
申请公布日期 |
2003.11.06 |
申请号 |
WO2003JP04979 |
申请日期 |
2003.04.18 |
申请人 |
TOKYO ELECTRON LIMITED;TANOUE, MITSUHIRO |
发明人 |
TANOUE, MITSUHIRO |
分类号 |
H01L21/027;H01L21/677;(IPC1-7):H01L21/68;B25J15/10;B65G49/07 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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