发明名称 SUBSTRATE CONVEYING MECHANISM AND SUBSTRATE CONVEYING METHOD
摘要 A substrate conveying mechanism capable of reducing a contact area between holding members and a substrate and accurately delivering the substrate through a placing plate on the placing plate for conveying the substrate, comprising the first holding member moved on the placing plate in a specified direction and capable of pushing the substrate on the placing plate from one side face thereof and the plurality of second holding members capable of pushing the substrate from the reverse side of the one side face interlockingly with the movement of the first holding member, whereby since the first holding member and the second holding members push the side faces of the substrate, the substrate on the placing plate can be held at a placing position.
申请公布号 WO03092068(A1) 申请公布日期 2003.11.06
申请号 WO2003JP04979 申请日期 2003.04.18
申请人 TOKYO ELECTRON LIMITED;TANOUE, MITSUHIRO 发明人 TANOUE, MITSUHIRO
分类号 H01L21/027;H01L21/677;(IPC1-7):H01L21/68;B25J15/10;B65G49/07 主分类号 H01L21/027
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