| 发明名称 |
Heatsink for surface mounting technology |
| 摘要 |
A cooling body for electronic components has a cooling surface (7) for contacting the components to be cooled. At right angles to this surface and beneath it is the surface-mounted technology (SMT) attachment surface (12) and above and parallel to this is a suction surface (10) for a SMT-pipette. |
| 申请公布号 |
EP1359619(A2) |
申请公布日期 |
2003.11.05 |
| 申请号 |
EP20030008576 |
申请日期 |
2003.04.14 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BAST, JOHANNES;SCHULZ, WOLFGANG;STANDAR, ROBERT |
| 分类号 |
H05K7/20;H01L23/36;H01L23/40;(IPC1-7):H01L23/40 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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