SPRING STRUCTURE AND ITS MANUFACTURING METHOD, INTEGRATED PROCESSING TOOL, AND MANUFACTURING METHOD OF SPRING STRUCTURE ON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a structure of a thin film spring decreased in or free from helical twisting.

SOLUTION: The spring structure 100 comprising a substrate 101 having an upper surface defining a plane and a spring finger formed from a stress- engineered film deposited over the substrate 101. The spring finger has an anchor portion 122 attached to the substrate 101 defining a second plane that is parallel to the first plane and a curved free portion 125 extending from the anchor portion 122 and bending out of the second plane away from the substrate 101. The anchor portion 122 of the spring finger includes at least one layer having an isotropic internal stress.

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