发明名称 |
METHOD FOR CUTTING OFF BUNDLED WORKPIECE |
摘要 |
PROBLEM TO BE SOLVED: To take out a plurality of small products W' from bundled workpieces WB in a collected state to some extent when the bundled workpieces WB are cut off using a band saw machine 1 provided with a front vise apparatus 49. SOLUTION: The bundled workpieces are cut off in such a state that a first front vise 53 is brought into contact with one side surface of the bundled workpieces WB, and further a second front vise 55 is brought near the other side surface of the bundled workpieces WB. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003311528(A) |
申请公布日期 |
2003.11.05 |
申请号 |
JP20020115126 |
申请日期 |
2002.04.17 |
申请人 |
AMADA ENG CENTER CO LTD;AMADA CO LTD |
发明人 |
SUZUKI SATORU;SATO MASAHIRO |
分类号 |
B23D55/04;B23D47/04;(IPC1-7):B23D55/04 |
主分类号 |
B23D55/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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