发明名称 METHOD FOR CUTTING OFF BUNDLED WORKPIECE
摘要 PROBLEM TO BE SOLVED: To take out a plurality of small products W' from bundled workpieces WB in a collected state to some extent when the bundled workpieces WB are cut off using a band saw machine 1 provided with a front vise apparatus 49. SOLUTION: The bundled workpieces are cut off in such a state that a first front vise 53 is brought into contact with one side surface of the bundled workpieces WB, and further a second front vise 55 is brought near the other side surface of the bundled workpieces WB. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003311528(A) 申请公布日期 2003.11.05
申请号 JP20020115126 申请日期 2002.04.17
申请人 AMADA ENG CENTER CO LTD;AMADA CO LTD 发明人 SUZUKI SATORU;SATO MASAHIRO
分类号 B23D55/04;B23D47/04;(IPC1-7):B23D55/04 主分类号 B23D55/04
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