WAFER CLEANING SYSTEM, CLEANING PROBE, AND WAFER CLEANING METHOD

摘要

PURPOSE: A wafer cleaning system, a cleaning probe, and a wafer cleaning method are provided to be capable of reducing the generation of pattern damage while carrying out a wafer cleaning process. CONSTITUTION: A wafer cleaning system is provided with a cleaning vessel, a wafer support part(60) located in the cleaning vessel for supporting a cleaning process object wafer, a wafer rotating part(80) connected to the wafer support part(60) for rotating the wafer, a probe rotating part(50), and a probe vibrator for generating mega-sonic vibration. The wafer cleaning system further includes a cleaning probe(20), wherein the cleaning probe has a coupling end and an elongated end. At this time, the coupling end of the cleaning probe is connected to the probe rotating part(50) and the probe vibrator, and the elongated end of the cleaning probe is located near the wafer. At the time, the elongated end of the cleaning probe includes a curvilinear groove.