MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To eliminate accidental etching on a wafer surface by preventing a liquid chemical used for back etching from sneaking to the wafer surface when the rear surface of the wafer is back-etched. SOLUTION: After a resist pattern is formed at the outermost peripheral part of the wafer surface, the rear surface of the wafer is back-etched using the liquid chemical to reduce the thickness of the wafer. The back etching is performed after allowing a passivation film to remain only at a scribe line that separates a semiconductor chip present at the outermost peripheral part of the wafer surface. COPYRIGHT: (C)2004,JPO