发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a trouble such as deformation or the like by restraining an external force applied on inner leads when lead frames are superposed. SOLUTION: Bending work is performed to outer frames 4 of the frames at both sides in the width direction along the length direction of the same whereby the bent parts of the outer frames projected obliquely outwardly in the same surface sides or ribs 5 are formed to receive an external force from vertical directions when the frames 1 are superposed by the ribs 5 so as not to apply the external force to the inner leads 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003309240(A) 申请公布日期 2003.10.31
申请号 JP20020112953 申请日期 2002.04.16
申请人 HITACHI CABLE LTD 发明人 KAWAMURA TOSHIO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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