| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which is capable of manufacturing wiring boards formed with fine vias on an industrial base. <P>SOLUTION: The wiring board 30 is formed with the vias 18 through a resin board 10, with one end of each via bonded to a wiring pattern 22 formed on one face of the resin board 10. The method of manufacturing the wiring board 30 comprises steps of: forming the vias 18 by filling the through holes 12 with metals by electrolytic plating wherein a thin metal layer 14 formed on the entire surface including inner wall faces of the through holes 12 formed through the resin board 10 used as a power supply layer; forming, on one face of the resin board 10, a metal layer 20 which is thicker than a metal layer 16 formed on the other face of the resin board 10; then, etching the metal layers 16 and 20 formed on both faces of the resin board 10 so that a prescribed thickness of the metal layer 20 is left over on one face of the resin board 10 while the metal layer 16 formed on the other face of the resin board 10 is removed; and patterning the metal layer 20 left over on one face of the resin board 10, to form the wiring pattern 22. <P>COPYRIGHT: (C)2004,JPO</p> |
