| 摘要 |
PROBLEM TO BE SOLVED: To shorten an inspection time by reducing a moving frequency between chips in an electron microscope having a function picking up a reference image, comparing it with a defect image, and automatically extracting an accurate defect position in a chip coordinate system for acquiring a defect observation image of high magnification. SOLUTION: When there are a plurality of defects in the same chip in defect position information based on the inspection by the defect inspection device, the electron microscope system acquires reference images corresponding to all the defects in the adjoining chips in order and then, moves the visual field of a microscope on the defect chip. This system takes steps of acquiring the defect image, extracting the defect position by the comparison of the defect image with the reference image, and acquiring the high magnification defect image in this order for every detect. COPYRIGHT: (C)2004,JPO
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