| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing which exhibits a sufficient flame-retardant property without containing a halogen (chlorine/bromine) compound and an antimony compound, which excels in moldability, continuous productivity, and reliability, and which is also capable of realizing a low stress, and to provide electronic parts sealing devices using the composition. SOLUTION: The resin composition contains as the essential components an epoxy resin (A), a phenolic resin (B), a phosphazene type fluororubber (C) represented by formula [I] (wherein m and n indicate each an integer of 1 or more), and an inorganic filler (D). The content of the phosphazene type fluororubber (C) to a resin component consisting of the above epoxy resin (A), phenolic resin (B) and phosphazene type fluororubber (C) is 0.5-30 wt.%, and in addition, based on a total of the resin composition for sealing, the content of the phosphorus component is 0.05-3.0 wt.% and the content of the inorganic filler is 70-95 wt.%. COPYRIGHT: (C)2004,JPO
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