发明名称 METHOD FOR MANUFACTURING PRINTED WIRING BOARD FOR ELECTRONIC PHOTOGRAPH
摘要 PROBLEM TO BE SOLVED: To eliminate a defective wiring board which is generated, because a normal electrostatic latent image cannot be formed on the board, where amount of charges of a photosensitive layer changes and a proper image cannot be formed on the board where formation of the electrostatic latent image has failed, in the method for manufacturing a printed wiring board for electronic photograph. SOLUTION: The defective wiring board can be solved, by providing the process to execute the heat treatment, before the formation of an electrostatic latent image in the method of manufacturing the printed wiring board for electronic photograph. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003309345(A) 申请公布日期 2003.10.31
申请号 JP20020113444 申请日期 2002.04.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KOMURO TOYOICHI;KANEDA YASUO
分类号 G03F7/20;H05K3/12;(IPC1-7):H05K3/12 主分类号 G03F7/20
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