| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for cleaning a scrub brush capable of maintaining a cleanness of the scrub brush and of being applied to a general brush scrub cleaner also. SOLUTION: A continuous unevenness 12 is formed on the surface of a dummy wafer 10. Similarly to a cleaning operation for a wafer which is ordinarily carried out, if the dummy wafer 10 is cleaned with a brush scrub cleaner 40, an impact is incurred on the scrub brushes 52, 52 by the unevenness 12 formed on the dummy wafer 10, and foreign substances adhering to the surfaces of the scrub brushes 52, 52 are brushed and removed. Thus, a cleanness of the scrub brush 52 can be maintained and a brushing time can be expected to reduce. Further, the dummy wafer 10 is mixed in the wafers input to the brush scrub cleaner 40, whereby the scrub brushes 52, 52 can be cleaned without lowering the availability factor of a device. COPYRIGHT: (C)2004,JPO
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