发明名称 METALLIC COVER FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a metallic cover for an electronic component having sufficient mechanical strength and superior heat resistance. <P>SOLUTION: In this metallic cover 10, a structure of a folded part 12 folded from one longitudinal side part of a flat part 11 and each of press-fit projecting parts formed near the folded part, is improved in comparison with a conventional type, that is, the folded part 12 is formed in such manner that it is continuously extended from one longitudinal side part of the flat part 11 by being folded, and each of the press-fit projecting parts 14 is formed by being punched out from the neighborhood of the one longitudinal side part of the flat part 11 and being folded to be extended to a tip-side outer part of the folded part 12 at its tip part by being bent at one longitudinal side part, whereby the continuity of the folded part 12 can be kept and the entire mechanical strength including press-fit projecting parts 14 can be remarkably improved in comparison with a conventional type, and the metallic cover of high heat resistance with sufficient mechanical strength can be provided. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003308490(A) 申请公布日期 2003.10.31
申请号 JP20020116456 申请日期 2002.04.18
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 MACHIHARA DAISUKE;MOTOJIMA YUZURU;SHIMADA MASAAKI
分类号 G06K17/00;H01R13/648;H01R13/658 主分类号 G06K17/00
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