| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board, in which cracks will not be generated easily, even if a bonding stress is applied due to the generation of bends in a mother board. SOLUTION: In the circuit board 10, where a plurality of recesses 2 are formed to the side surface of a ceramic basic substance 1 of almost square shape and terminal electrodes 3 are deposited at the internal surfaces of these recesses 2, at least four recesses among a plurality of recesses 2 are formed by opening thereof to both surfaces of two side surfaces, located in both sides of each corner portion of the ceramic basic substance 1. Moreover, these are formed so as to satisfy the relationship 'a>b', when the opening width of one side surface of the recesses 2 is a and the opening width of the other side surface thereof is b. COPYRIGHT: (C)2004,JPO
|
