发明名称 |
BIMODAL SLURRY SYSTEM |
摘要 |
A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.
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申请公布号 |
US2003200702(A1) |
申请公布日期 |
2003.10.30 |
申请号 |
US20020132441 |
申请日期 |
2002.04.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LEE SHEN-NAN;SHIH TSU;JANG SYUN MING |
分类号 |
C09G1/02;C09K3/14;(IPC1-7):C09K3/14;C09G1/04 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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