发明名称 BIMODAL SLURRY SYSTEM
摘要 A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.
申请公布号 US2003200702(A1) 申请公布日期 2003.10.30
申请号 US20020132441 申请日期 2002.04.25
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LEE SHEN-NAN;SHIH TSU;JANG SYUN MING
分类号 C09G1/02;C09K3/14;(IPC1-7):C09K3/14;C09G1/04 主分类号 C09G1/02
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