发明名称 |
MEMORY CARD |
摘要 |
PURPOSE: A memory card is provided to be capable of overcoming the limit of capacity and size and reducing manufacturing processes by omitting a cover attaching process. CONSTITUTION: A memory card(10) is provided with a card board(21), a plurality of memory chips(11,13) sequentially stacked on the upper portion of the card board, a control chip(15) mounted on the memory chips and a bonding wire(25) for electrically connecting the chips with the card board. The memory card further includes a passive element(17) attached at the peripheral portion of the memory chips and a molding part(41) for selectively encapsulating the resultant structure. Preferably, a plurality of adhesive parts(33,35) are located between the memory chips and the control chip for securing the space for the bonding wire. |
申请公布号 |
KR20030083306(A) |
申请公布日期 |
2003.10.30 |
申请号 |
KR20020021786 |
申请日期 |
2002.04.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SON, MIN YEONG;OH, SE YONG;JUNG, TAE GYEONG |
分类号 |
H01L23/50;G06K19/077;H01L23/538;H01L25/065;H01L25/18 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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