Data carrier with an IC module and a method for producing such a data carrier

摘要

The integrated circuit embedded in a data carrier and the contact surfaces connected with this circuit are to be protected against bending of the data carrier. For this purpose, the data carrier is divided into two areas, the first one, which bears the circuit and is generally small compared to the second area, being connected to the second area via a predetermined breaking point. Stress which occurs when the data carrier is bent is kept away from the circuit, or transmitted only weakly to it, by the predetermined breaking point.