| 摘要 |
The present invention relates to a polishing instrument for polishing a surface into a predetermined configuration. The present invention aims to provide a polishing instrument superior in operability and stability and capable of polishing a surface into a desired configuration. The polishing instrument of the present invention includes: a rotatable rotary substrate portion equipped with a polishing plane holding a polishing material on its surface; a plurality of movable substrate portions equipped with polishing planes which hold the polishing material on their surfaces, which are provided in the peripheral edge of the rotary substrate portion, and which rotate about a connection line connecting them to the rotary substrate portion; and elastic members for biasing the polishing planes of the movable substrate portions toward a position where they are flush with the polishing plane of the rotary substrate portion.
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