| 摘要 |
PROBLEM TO BE SOLVED: To prevent soldering failure such as shrinkage holes or voids, etc., and to reduce the number of repair steps accompanied with defective soldering by quickly cooling the side of a circuit as well as the side of soldering surface in a cooling step, in a printed board where an electrode or a lead of the circuit part is soldered. SOLUTION: The printed board is provided with a board 1 and a conductive rounds 4 made of copper foil that is etched onto the board 1 and wherein an electrode of a circuit 2 or a lead is soldered to the board 1, and a penetrated part 6 is formed in the vicinity of the round 4 of the board 1 or in a part where the round 4 of the board 1 is etched. COPYRIGHT: (C)2004,JPO |
