| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal coupling of a cooling device comprising at least one support member (12), at least one electrical element (10) provided to the support member (12), and at least one cooling body (22, 24) for releasing heat generated by the element (10). SOLUTION: The support member (12) has at least one heat lead-out element (18). The heat lead-out element is thermally coupled to the element (10) with the cooling body (22, 24). COPYRIGHT: (C)2004,JPO |
