| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of transporting substrate that makes heating time freely settable in a soldering reflow furnace. SOLUTION: In this method, a printed board mounted with parts can be transported in the soldering reflow furnace by supporting both ends of the board by two rails formed in L- or U-shapes, while pushing the rear side of the board with a projection attached to a rope or chain by changing the advancing speed of the board so that the board may be stopped. COPYRIGHT: (C)2004,JPO
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