ORGANOSILICATE POLYMER AND INSULATING LAYER CONTAINING THE POLYMER

摘要

PURPOSE: An organosilicate polymer, its preparation method, a composition for preparation of an insulating layer, an insulating layer containing the polymer, its preparation method and a semiconductor device containing the insulating layer are provided, to improve the mechanical properties and the low dielectric characteristic of an organosilicate polymer and to enhance the insulating property, the uniformity of coating, the dielectric characteristic and the mechanical properties of an insulating layer. CONSTITUTION: The organosilicate polymer is prepared by providing a hydrosilane compound; oxidizing the hydrosilane compound in the presence of water or an alcohol; and mixing a solvent with the oxidized hydrosilane compound or the mixture of the oxidized hydrosilane compound and a silane compound or a silane oligomer, and hydrolyzing and condensing the mixture in the presence of water and a catalyst. Preferably the hydrosilane compound is the hydrosilane oligomer represented by R1nSi(OSi)mH(2m-n+4) or the cyclic hydrosilane oligomer represented by the formula, wherein R1's are independently H, F, an aryl group, a vinyl group, an allyl group or a linear or branched alkyl group of C1-C4 unsubstituted or substituted with F; m is an integer of 1-20; n is an integer of 1-20; R2's are independently H, F, an aryl group, a vinyl group, an allyl group or a linear or branched alkyl group of C1-C4 unsubstituted or substituted with F; k is an integer of 3-10; l is an integer of 3-10.