发明名称 |
SEMICONDUCTOR CHIP PACKAGE WITH DIRECTION-FLEXIBLE MOUNTABILITY |
摘要 |
A semiconductor chip package with direction-flexible mountability comprising a switching circuit for switching a pin function according to the mounting direction of a package, a pair of pin-definition pins for defining the pin function and a pair of power supply leads, and a pair of ground leads. One of the power supply lead pair and the ground lead pair is rotation-symmetrical to the other, respectively. The semiconductor chip package with direction-flexible mountability in accordance with the present invention eliminates a process for indicating the mounting direction because the package can be mounted onto a substrate regardless the direction. Accordingly, the ID pin indication and a series of processes for testing the ID pin are eliminated and the malfunction due to the incorrect direction is prevented. |
申请公布号 |
US2003197263(A1) |
申请公布日期 |
2003.10.23 |
申请号 |
US20020293532 |
申请日期 |
2002.11.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG YI-SUNG;KIM SANG-WOO |
分类号 |
H01L23/12;H01L21/822;H01L23/48;H01L23/50;H01L27/04;H05K1/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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