METHOD FOR FORMING HOUSINGS FOR ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENTS THAT ARE HERMETICALLY ENCAPSULATED THEREBY

摘要

The aim of the invention is to obtain a largely water diffusion-tight encapsulation of electronic components at moderate temperatures of less than 300 DEG C, preferably less than 150 DEG C. To this end, the invention provides a method for forming housings for electronic components, particularly sensors, integrated circuits and optoelectronic components. This method comprises the following steps: providing a substrate (1), whereby at least one first substrate side (1a) is to be encapsulated; providing a vapor deposition glass source (20); placing the first substrate side (1a) relative to the vapor deposition glass source in a manner that enables the first substrate side (1a) to be subjected to a vapor deposition, and; vapor-depositing the first substrate side with a glass layer (4).