Electron beam exposure apparatus, electron beam exposure method, semiconductor device manufacturing method, and electron beam shape measuring method

摘要

An electron beam exposure apparatus for exposing a wafer by an electron beam, including: an electron beam generation section for generating the electron beam; an electron beam shaping member with a plurality of openings for shaping the electron beam; a deflecting section for deflecting the electron beam which has passed through the electron beam shaping member; and a deflection correction control section for controlling the deflecting section based on a position of the opening of the electron beam shaping member through which the electron beam passes. The deflecting section deflects the electron beam and corrects distortion of an image of the electron beam on the wafer.