DEVICE AND METHOD FOR BURNING-IN AND TESTING MULTI-CHIP PACKAGE

摘要

PURPOSE: A device and a method for burning-in and testing multi-chip package are provided to improve the productivity thereof by implementing the burn-in and test matching with the characteristics of products. CONSTITUTION: A method for burning-in and testing multi-chip package includes the steps of: loading a plurality of packages on the palette received at the burn-in and test device and operating the device; setting(S30) the various multiplex selection and test conditions for each of the packages; implementing(S32) the contact test; randomly selecting(S34) the multiplex condition corresponding to the package; setting(S36) the temperature; test running(S38) the first test package based on the information down loaded; identifying(S40) whether the defect is occurred or not; finishing after chamber alarm is implemented when the device defect is detected and identifying the final test item if the device defect is not detected; and finishing(S42) the process if the final test item is a normal state.