发明名称 IC PACKAGE PRESSURE RELEASE APPARATUS AND METHOD
摘要 An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
申请公布号 KR20030082935(A) 申请公布日期 2003.10.23
申请号 KR20037008862 申请日期 2003.06.28
申请人 发明人
分类号 H01L23/02;H01L23/10;H01L21/50 主分类号 H01L23/02
代理机构 代理人
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