| 摘要 |
<p>A copper foil with carrier foil enabling perforating a surface of copper foil as an outer layer of copper clad laminate by carbon dioxide gas laser without any nickel auxiliary metal layer and organic material coating for increasing the absorption of laser beam. The thus employed copper foil with carrier foil is, for example, one comprising a carrier foil and a copper foil for production of a printed wiring board including a bulk copper layer having its one main surface side roughened, the carrier foil and the copper foil stacked through a junction interface layer on the bulk copper layer at its side opposite to the roughened surface, characterized in that the bulk copper layer is constituted of a high carbon content copper wherein the carbon content is in the range of 0.03 to 0.40 wt.%.</p> |
