发明名称 Polishing composition and polishing method employing it
摘要 A polishing composition which comprises the following components (a) to (d): (a) silicon dioxide, (b) at least one basic substance selected from the group consisting of an inorganic salt of an alkali metal, an ammonium salt, piperazine and ethylenediamine, (c) at least one chelating agent selected from the group consisting of a compound represented by the following general formula Ä1Ü and its salt: <CHEM> wherein each of R1 and R2 which are the same or different, is a lower alkylene group, and n is an integer of from 0 to 4, and (d) water.
申请公布号 EP1229094(A3) 申请公布日期 2003.10.22
申请号 EP20020250621 申请日期 2002.01.30
申请人 FUJIMI INCORPORATED 发明人 KAWASE, AKIHIRO;OKAMURA, MASAO;INOUE, YUTAKA
分类号 C09K3/00;B24B37/00;C09G1/02;C09K3/14;H01L21/304;H01L21/306;(IPC1-7):C09G1/02;H01L21/321 主分类号 C09K3/00
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