发明名称 PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet on which the pitches and linearity of a plurality of bar-like arrangements of semiconductor chips stuck in parallel with equal pitches at optional positions are prevented from varying when the sheet is stretched and which enables the recognition work by an automatic recognition camera in post-steps to be efficiently carried out. SOLUTION: This pressure-sensitive adhesive sheet 101 comprises a stretchable base material 102, e.g. a polyvinyl chloride or polyester sheet, and a photosensitive adhesive layer 3 which is formed on the surface of the base material 102 and has a pressure-sensitive adhesive power decreasing under the irradiation with ultraviolet rays. In the base material 102, a fibrous member 103 comprising a material (e.g. glass fibers) having stretchability lower than that of the base material 102 is embedded in parallel with a pitch somewhat larger than the length of a semiconductor bar 5 as an object to be treated. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003301145(A) 申请公布日期 2003.10.21
申请号 JP20020106345 申请日期 2002.04.09
申请人 NEC KANSAI LTD 发明人 TANAKA KIYOHIKO
分类号 C09J7/02;H01L21/301;(IPC1-7):C09J7/02 主分类号 C09J7/02
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