| 摘要 |
In an apparatus for bonding window pieces to envelope blanks having window cut-outs, window pieces are cut from a transparent material web and then the window pieces and envelope blanks are brought together by a suction roller serving as a bonding cylinder and joined to one another by adhesive applied onto the window pieces by a gluing mechanism while the window piece is on the suction roller before being joined to the envelope blank. A suction belt conveyor device is provided, at least in the region of the joining location, as a carrier for the envelope blanks and as a counter-tool for the suction roller serving as a bonding cylinder.
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