| 摘要 |
A semiconductor device comprises a semiconductor IC chip provided with bond pads on its first surface, a wiring board provided with a through hole extending between the opposite surfaces thereof, conductive members electrically connecting the bond pads of the semiconductor IC chip to those formed on the wiring board, and a sealing resin coating coating the surface of the semiconductor IC chip and the conductive members, and bonding the side surfaces of the semiconductor IC chip to the side surfaces of the through hole of the wiring board.
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