发明名称 MODULE REMOVAL TOOL AND OPTICAL MODULE
摘要 PROBLEM TO BE SOLVED: To provide a module removal tool for easily removing an optical module from an external substrate and to provide the optical module. SOLUTION: This module removal tool 120 is a metallic flat plate-shaped member, and an engagement part 122 which can be engaged with a part-to-be- engaged 92 is provided at a side of an opening 90 at a lower housing 80 of an optical transceiver module M1 by bending one end of the module removal tool. The engagement part 122 of the module removal tool 120 is inserted in the part-to-be-engaged 92 of a housing 24 (lower housing 80) of the optical transceiver module M1 to be engaged. Then the module removal tool 120 is tilted with the engagement part 122 engaged with the part-to-be-engaged 92 to lift up a part on a side in which the part-to-be-engaged 92 engaged with the engagement part 122 is formed in the housing 24, and to release the engagement condition between a connector terminal 20 of the optical transceiver module M1 and a connector terminal 132 of the external substrate 130. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003300177(A) 申请公布日期 2003.10.21
申请号 JP20020106870 申请日期 2002.04.09
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YOSHIKAWA SATOSHI
分类号 B25B27/14;H01L31/02;H01R13/512;H01R13/66;H01S5/022;(IPC1-7):B25B27/14 主分类号 B25B27/14
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