发明名称 THERMOSETTING ADHESIVE SHEET WITH ELECTROCONDUCTIVE AND THERMOCONDUCTIVE PROPERTIES
摘要 A thermosetting adhesive sheet with electroconductive and thermoconductive properties, which comprises a thermosetting adhesive sheet composed of a thermosetting adhesive composition comprising an ethylene-glycidyl (meth)acrylate copolymer and a carboxyl group-containing rosin, where crosslinking is formed between the ethylene of the copolymer by electron beam radiation, and having at least one through-opening region formed at a prescribed location, and further including a low melting point solder placed within said through-opening region(s) formed at the prescribed location(s).
申请公布号 AU2003226175(A1) 申请公布日期 2003.10.20
申请号 AU20030226175 申请日期 2003.04.01
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 SHIGEYOSHI ISHII;MASAAKI TAKEDA;AKIHIKO MITSUI;KOHICHIRO KAWATE
分类号 B32B27/30;C08L93/04;C09J7/00;C09J9/02;C09J123/08;C09J133/14;C09J163/00;C09J193/04;H01B1/22;H01L23/373;(IPC1-7):H01L23/373 主分类号 B32B27/30
代理机构 代理人
主权项
地址
您可能感兴趣的专利