发明名称 |
DEVICE AND METHOD FOR TREATING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a device for treating a substrate in which the substrate can be treated uniformly by treatment liquid. SOLUTION: The device for treating the surface of a substrate W by jetting treatment liquid thereto comprises a carrying shaft 4 having a roller 5 for carrying the substrate along a specified direction, and a plurality of nozzles 21 arranged at least in the direction intersecting the carrying direction of substrate out of the carrying direction and the intersecting direction at a specified interval above the substrate being carried and jetting the treatment liquid to the substrate in a rectangular pattern such that side parts of adjacent rectangular patterns are overlapped. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003297799(A) |
申请公布日期 |
2003.10.17 |
申请号 |
JP20020093314 |
申请日期 |
2002.03.28 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
NISHIBE YUKINOBU;ISHIKAWA HIROKO;ISO AKINORI;SUEYOSHI HIDEKI |
分类号 |
G03F7/30;H01L21/027;H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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