发明名称 DEVICE AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device for treating a substrate in which the substrate can be treated uniformly by treatment liquid. SOLUTION: The device for treating the surface of a substrate W by jetting treatment liquid thereto comprises a carrying shaft 4 having a roller 5 for carrying the substrate along a specified direction, and a plurality of nozzles 21 arranged at least in the direction intersecting the carrying direction of substrate out of the carrying direction and the intersecting direction at a specified interval above the substrate being carried and jetting the treatment liquid to the substrate in a rectangular pattern such that side parts of adjacent rectangular patterns are overlapped. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003297799(A) 申请公布日期 2003.10.17
申请号 JP20020093314 申请日期 2002.03.28
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISHIKAWA HIROKO;ISO AKINORI;SUEYOSHI HIDEKI
分类号 G03F7/30;H01L21/027;H01L21/306;(IPC1-7):H01L21/306 主分类号 G03F7/30
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