| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely conductively connect a semiconductor chip and rewiring and to batch process a plurality of semiconductor chips, in a semiconductor device provided with a connection terminal by a soldering ball also to the outside of the size of the semiconductor chip. <P>SOLUTION: A plurality of the semiconductor chips 23 are bonded onto a bonding layer 22 on a base plate 21. First to third insulation films 31, 35, and 39, first and second base metal layers 33, 37, first and second rewirings 34 and 38, and the soldering ball 41 are batch formed on a plurality of the semiconductor chips. In this case, the first and second base metal layers 33 and 37 are formed by sputtering, first and second rewirings 34 and 38 are formed by electroplating. Then, between the respective semiconductor chips 23, the three layers of insulation films 39, 35, and 31, the bonding layer 22 and the base plate 21 are cut off. <P>COPYRIGHT: (C)2004,JPO |
