发明名称 DEVICE AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for treating a substrate in which an increase in drying cost can be controlled without generating a water mark. SOLUTION: When a fluorine based solvent, i.e., HFE (hydrofluoroether), is supplied from a nozzle 50 for ejecting a drying agent while rotating a cleaned substrate W held on a rotor 30, pure water on the substrate W is shaken off by a centrifugal force and the HFE evaporates quickly together with water drops entering a fine pattern formed on the substrate W. Consequently, drying performance can be enhanced while controlling the failure of drying in the fine pattern. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003297794(A) 申请公布日期 2003.10.17
申请号 JP20020095694 申请日期 2002.03.29
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MOTOMURA MASAHIRO
分类号 F26B3/04;F26B5/08;F26B7/00;F26B9/06;F26B21/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 F26B3/04
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