| 摘要 |
PROBLEM TO BE SOLVED: To enable a substrate connecting device to obtain a prescribed connection quality to each substrate pair even when the substrate pair has a different thickness when simultaneously heating and pressing a plurality of substrate pairs piled upon another with an anisotropic conductive material being interposed between the electrode lead sections of each two substrates. SOLUTION: When simultaneously heating and pressing two substrates by interposing the anisotropic conductive material between the electrode lead sections of the substrates by means of an anvil plate disposed on a base side 10 and a vertically movable thermocompression bonding head, the anvil plate is divided into a plurality of independent vertically movable lower blades 141 and 142 and the blades 141 and 142 are elastically supported by means of lower blade supporting means 40 (for example, rubber-made cushioning materials 41) in vertically movable states. COPYRIGHT: (C)2004,JPO
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