INTEGRATED POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An integrated power module and a method for manufacturing the same are provided to be capable of improving cooling efficiency and reducing process time by directly attaching an epoxy resin plate on a cooling pin. CONSTITUTION: An integrated power module is provided with an epoxy resin plate(76) mounted with a plurality of circuit devices, a cooling pin(74) directly attached on the back side of the epoxy resin plate, and a rectangular type case(80) for enclosing the epoxy resin plate. Preferably, a plurality of pins(82) are installed at the upper portion of the case for supplying the first driving signal of the outside to the circuit devices and transmitting the second driving signal generated from the circuit devices to the outside. Preferably, the cooling pin is made of aluminum.