| 摘要 |
PROBLEM TO BE SOLVED: To reinforce a ground pattern formed on the reflow-treated surface of a printed circuit board without providing any special working process in the manufacturing process of the board. SOLUTION: A method of manufacturing the printed circuit board includes a first step 101 of forming a wiring pattern on a substrate 10, a second step 102 of forming a solder resist layer 4 on a substrate 11 except lands 2 to which the terminals of parts are soldered and a reinforcing wiring pattern, and a third step 103 of applying cream solder 5 to the surfaces of the lands 2 and ground pattern 3. The method also includes a fourth step 104 of placing surface- mounted parts 6 on a substrate 12 and a fifth step 105 of heating a substrate 14 on which the surface-mounted parts 6 are placed. In addition, the method also includes a step of placing a reinforcing metallic sheet 7 on the ground pattern 3 after the third step 103 of applying the cream solder 5 to the surfaces of the lands 2 and ground pattern 3. COPYRIGHT: (C)2004,JPO
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