| 摘要 |
PURPOSE: A wafer alignment method is provided to be capable of preventing the deterioration of process efficiency and minimizing alignment failure by automatically selecting a global alignment sensor according to the setting condition. CONSTITUTION: A short wave signal and a wide-band signal of an alignment mark are detected by using the first and second sensor(S10,S12). The detected short wave signal and wide-band signal are compared with the reference frequency range(S14). One out of the short wave signal and the wide-band signal is selected when the reference frequency range includes the one(S16). An alignment process is carried out by using the first and second sensor according to the result of the selected signal(S18,S20,S24). Preferably, failure is decided when the signals are included in another frequency range(S22).
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