发明名称 REINFORCING SHIELD FILM AND SHIELD FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a shield FPC with which coloring, surface printing and adhesion of a reinforcing plate are easy, which is not discolored and swollen even if it is heated in a process after solder reflow and which is superior in electromagnetic wave shielding property and in flexibility and to provide a reinforcing shield film suitable for using for FPC. SOLUTION: In the reinforcing shield film, a shield layer 8 is disposed on one face 7 of a cover film and an adhesive layer 10 formed of heat resistant and solvent resistant adhesive and a reinforcing film 6 which can easily be peeled from the adhesive layer are sequentially disposed on the other face. The film is stuck onto a substrate film 5 such as FPC. Conductive adhesive 8a in the shield layer 8 is heated (h) and pressurized (p) so that it is brought into contact with a part 3c of a ground circuit 3b. Then, the reinforcing film is peeled off (f). COPYRIGHT: (C)2004,JPO
申请公布号 JP2003298285(A) 申请公布日期 2003.10.17
申请号 JP20020093969 申请日期 2002.03.29
申请人 TATSUTA ELECTRIC WIRE & CABLE CO LTD 发明人 UENO KENJI;KAWAKAMI TOKINORI;TERADA TSUNEHIKO;MORIMOTO SHOHEI
分类号 B32B27/00;C09J7/02;C09J9/02;C09J11/04;C09J201/00;H05K9/00;(IPC1-7):H05K9/00 主分类号 B32B27/00
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