| 摘要 |
PURPOSE: An apparatus for attaching a protection tape for a metal CSP(Chip Size Package) is provided to be capable of preventing the deformation and damage of a lead of a lead frame when carrying out a bonding process at the metal CSP by using the first, second, and third guide roller, and a vacuum block. CONSTITUTION: An apparatus for attaching a protection tape(14) for a metal CSP is provided with the first, second, and third guide roller(8,9,10) sequentially installed at a base plate(11) for guiding the protection tape, a vacuum block(3) having an additional suction line, connected to the first cylinder(3a) installed at the base plate for adsorbing the protection tape supplied from the third guide roller, a cutter(4) connected to second cylinder(4a) for being moved up and down, a plurality of compressible rollers(5) connected to the third cylinder(5a), a transfer die(7) installed at the upper portion of a table(12) for transferring a lead frame(13), and a cutting die(6) located at the front portion of the vacuum block for fixing the protection tape.
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