Verfahren zum mechanischen Befestigen von elektrischen Bauteilen auf einer Platine sowie eine Vorrichtung hergestellt nach diesem Verfahren

摘要

The mechanical fixing method uses an adhesive (17) which is injected into the gap (22) between the electrical component (11) and the surface of the printed circuit board (10) after electrically connecting the component electrical contacts (16) with the corresponding contact zones (15) of the printed circuit board. The adhesive is injected via a needle around the edge (19) of the electrical component and provides simultaneous encapsulation of the contact connections. An Independent claim for a mechanical connection between an electrical component and a printed circuit board is also included.