| 摘要 |
PURPOSE:To prevent the peeling of a bump by forming the thin first bump and forming a protective polyimide film. CONSTITUTION:A Ti film 1, a Pt film 2 and an Au first bump 3 are formed on an insulating film 5 on the surface of an integrated circuit. A polyimide film 6 is applied. A Pd film 7 is shaped on the whole surface through sputtering. A photo- resist film 8 is patterned to form an opening section 10. The film 7 is removed while using the film 8 as a mask. A second bump 4 is formed through electrolytic Au plating while using the film 7 as an electrode. The films 8, 7 are removed. |
