BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES AND COLLETS FOR BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES
摘要
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.
申请公布号
WO03010798(A3)
申请公布日期
2003.10.16
申请号
WO2002US23067
申请日期
2002.07.22
申请人
CREE, INC.;CREE LIGHTING COMPANY;CREE MICROWAVE, INC.
发明人
SLATER, DAVID;BHARATHAN, JAYESH;EDMOND, JOHN;RAFFETTO, MARK;MOHAMMED, ANWAR;NEGLEY, GERRY;ANDREWS, PETER