| 摘要 |
An optical integrated circuit element package comprises a lead frame, a chip, a wall, and a transparent cover. The lead frame has a plurality of leads substantially coplanar and defining a central region, and a die pad is disposed on the central region. The chip is disposed on the die pad and has an optical integrated circuit element and a plurality of pads which are electrically connected to the plurality of leads by a plurality of bonding wires. The height of the wall is higher than the chip and the plurality of bonding wires, and the wall has an extending portion hermetically extending between the die pad and the plurality of leads. The extending portion is substantially coplanar with the leads, and the plurality of leads are exposed out of the lower surface of the extending portion. The transparent cover hermetically covers the wall.
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