Package, used as a composite component, comprises a substrate with opposite-lying base and joining surfaces, a semiconductor component and a sleeve joined together

摘要

Package comprises a substrate (1) with opposite-lying base and joining surfaces, a semiconductor component (3) and a sleeve (2) joined together. The substrate has an asymmetrical heat expansion and is structured so that the heat expansion coefficient of the joining surface and the base surface differs by at least 2%. An Independent claim is also included for the production of the package. Preferably the heat expansion coefficient (alphaSF) of the substrate joining surface and the heat expansion coefficient (alphaSG) of the substrate base surface fulfills the condition (1). 1.02 less than alphaSG/approximatelyasF more than 8. The substrate is made from a layer composite in which the uppermost layer facing the semiconductor component is made from copper (Cu), molybdenum (Mo)-Cu, tungsten (W)-Cu, aluminum (Al), silver (Ag), gold (Au), aluminum nitride (AlN), beryllium oxide (BeO) or a carbon fiber/Cu composite.