CIRCUIT ARRANGEMENT WITH SEMICONDUCTOR ELEMENTS ARRANGED IN CHIPS

摘要

A circuit arrangement with semiconductor elements arranged in chips is described. The circuit arrangement is characterized by at least one metal body (s 1 ) for electrically contacting the semiconductor elements and for dissipating the heat produced by the semiconductor elements, said metal body (s 1 ) being adapted to simultaneously function as the support for the semiconductor elements and the chips (c 1 ) of the semiconductor elements being fastened on the body (s 1 ).