| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for controlling a plating bath by which organic compounds in the plating bath can be decomposed by a simple method without exerting an adverse effect upon plating performance. SOLUTION: At least one kind of oxidized halide selected from the group consisting of hypochlorous acid, chlorous acid, chloric acid, perchloric acid, hypobromous acid, bromous acid, bromic acid, hypobromic acid, hypoiodous acid, iodous acid, iodic acid, periodic acid and their salts is added, so that organic compounds in the plating bath are decomposed. COPYRIGHT: (C)2004,JPO
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